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Arrow Asia Joins Altera to Host Technology Roadshow 2010 in 15 Cities Across Asia
The seminars will be held in China, Singapore, Malaysia, Taiwan and India, from August through November of 2010. At these seminars, attendees will learn how to overcome today's high-end digital system design challenges and enhance system performance with Altera's product portfolio including Stratix® V and IV FPGAs, Arria® II GX FPGAs, Cyclone® IV FPGAs, and the latest IPs and solutions. Click here to find out more.
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TI - Complete Analog Front End for ECG/EEG
The eight-channel, 24-bit ADS1298 is the first in a family of fully integrated analog front ends (AFEs) for patient monitoring, portable and high-end electrocardiogram (ECG) and electroencephalogram (EEG).
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ADI Blackfin(r) BF50x Processors Roadshow in China
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Check out High-Reliability Solutions from TI and Arrow (view webcast in Mandarin)
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Purchasing Market Trend - Asia Pacific 
This report provides general information on purchasing trend of product segments including Analog, Discrete, Embedded, Logic, Connectors..etc. Contact your local Arrow sales representative to find out how Arrow can help you manage inventory assets more effectively and increase your supply chain efficiency.
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TI Car Access System 
Car access functions are normally the immobilizer and the remote keyless entry system. For more advanced systems passive entry and passive start functions are implemented that allow unlocking or starting of the car by simply getting close to it. TI RFID Automotive products offer market unique features and performance.
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Freescale Powertrain control for Gasoline Engine Management
Powertrain systems established electronic control technology in vehicles. Freescale has been there since the beginning of microprocessor implementation in vehicles and at every performance-enhancing milestone since. Built on industry-leading microcontroller technology and supported by sensors and analog/mixed signal ICs to provide a more complete system solution, we provided the enabling technologies to help system designers achieve improved performance and efficiency.
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Tyco Electronics - Decentralized Architecture for Automotive Harness Protection
Employing a decentralized architecture combined with PPTC overcurrent protection can significantly reduce weight in automotive designs. Although a decentralized approach has been understood for many years, the recent availability of thinner wires that can carry higher current, as well as new industry incentives, makes this approach clearly superior to conventional fusing techniques. Due to their resettable functionality, low-resistance characteristics, and a wide array of current ratings, PPTC devices can help automotive designers reduce wire length and weight, facilitate design flexibility and enhance system reliability.
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Fairchild Semiconductor - Automotive power densities push for packaging innovation
Power electronics packaging is experiencing new trends as a result of the needs of high power application, with the automotive market being a strong driver. The continuous electrification of functions in the vehicle, moving to higher power such as electric power steering, starter alternators, air conditioning, water pump up to the traction inverter, requires new solutions that can be met with power modules rather than discrete components.
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Infineon Technologies - Minimizing “Cost-of-Ownership” at Motor Applications
In industrial nations up to more then half of all electrical energy is consumed by electric motors. Electric motors account for two-thirds of industrial electric consumption and about one-fourth of residential electric use. Therefore improving the efficiency of electric motors can significantly save energy and reduce operating costs. Because of this, energy efficiency should be a major consideration designing a motor drive, and not as usual "What’s the price of the motor?"
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ISSI - Enhancing Long-Term Reliability with Copper Leadframes
One of the points to consider when selecting a semiconductor device is the package reliability, relative to the operating conditions of the electronics application. With this in mind, ISSI recently added synchronous DRAMs to its extensive portfolio of products offered in copper leadframes, which includes SRAMs and EEPROMs.
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Linear Technology- Fault Monitoring in Less Than Perfect Battery Management Systems
Consider the old adage known as Murphy’s law that states, “Anything that can go wrong will go wrong.” Electronics-based systems have evolved over the past 50 years to provide very sophisticated monitoring and control functions with remarkable reliability. Reliability concerns typically relate to the amount of potential risk to human life, followed closely by the high cost of failure and product user satisfaction. Nothing is ever perfect, however, so there will always be a need for ever-increasing reliability to produce safe, long-lasting electronic systems.
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NXP releases industry’s largest range of automotive qualified Power SO-8 MOSFETs in LFPAK
NXP Semiconductors is the first supplier to launch a full range of automotive power MOSFETs housed in the compact, thermally enhanced Loss Free PAcKage (LFPAK). The new range of Q101 qualified LFPAK MOSFETs combines NXP’s expertise in packaging technology and its experience in TrenchMOS technology to deliver what is believed to be the most reliable Power SO-8 package in the world. LFPAK is optimised for high-density automotive applications with a footprint 46%smaller than that of DPAK whilst offering similar thermal performance.
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High Speed Low Power CAN Transceiver from ON Semiconductor
The latest high speed controller area network (CAN) transceiver from ON Semiconductor, the NCV7340 has lower power consumption, enhanced electromagnetic compatibility (EMC) and Electrostatic discharge (ESD) performance compared with its predecessors. The new device is part of the latest generation of CAN high speed transceiver family, and is not only used in 12 V supply voltage, but also operates well at 24 V supply voltage. It also accepts input signal at 5 V and 3.3 V logic level from the microcontroller unit (MCU), and meets the demands for high speed CAN transceivers for various electronic controller units (ECUs) in automotive applications.
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The Renesas Approach to Vehicle Control: Body Control Solutions
Body control systems are used to implement features such as the power windows and electrically operated sliding doors that help make vehicles more comfortable and pleasant. They support the business objective of "building cars that are kind to people." The broad span of compatible Renesas microcomputers in the M16C family satisfy the diverse design requirements of body control applications, many of which involve controlling various types of electric motors.
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Spansion: Driving Automotive Innovation
Spansion® has a rich history of servicing the high quality and reliability demands of the automotive market. Our unwavering commitment to quality excellence is manifested through continuous compliance of the rigorous ISO/TS 16949 standards, the Automotive Electronics Council (AEC) specifications and membership in the Semiconductor Industry Association (SIA).
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STMicroelectronics - Flexible smart-power solution for a wide range of automotive applications
Designed using STMicroelectronics' advanced technologies, the L99MC6 is a novel and highly-flexible device, able to drive a multitude of different types of load. Equipped with a standard serial peripheral interface (SPI), it embeds six protected and programmable smart-power switches in a configurable combination of low-side and high-side outputs (3 low-side switches plus 3 high-/low-side switches).
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Texas Instruments Pressure Sensor Signal Conditioning Interface
The TPIC83000 is a single-channel, signal conditioning device for pressure sensors used in low-pressure sensing applications such as passenger occupancy indication/detection and pedal pressure sensing. The pressure sensor can be >more
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3M's New Power Clamp Connectors and Cables Solutions from 3M Provide Reliable,
The 3M Power Clamp Wiremount Socket, 355 Series; the 3M Power Clamp Header, 356 Series; and 3M Power Clamp Branch Connector, 357 Series are designed to provide connection reliability and cost performance in I/O applications, >more
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Altera Delivers Industry's First Single-Chip Solution for HD WDR Surveillance Cameras
Hong Kong, June 23, 2010—Expanding its FPGA solutions for the surveillance market, Altera Corporation (NASDAQ: ALTR) announced today the industry's first high-definition (HD), surveillance internet protocol (IP) camera reference >more
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ADI: Full-Featured Pedometer Design Realized with 3-Axis Digital Accelerometer
Pedometers, now popular as an everyday exercise progress monitor and motivator, can encourage individuals to compete with themselves in getting fit and losing weight. Early designs used a weighted mechanical switch to detect >more
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Bourns Product News! New PortNote™ Solutions and Corresponding Design Kits Released!
The majority of circuit protection products are designed into variations of just a few ports. Each PortNote™ Solution provides on a single page a simple starting point for the protection of a particular port, making them easy to >more
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Broadcom Announces New Feature-Rich 802.11n VoIP Router Solutions with 3G USB Modem Support
6/17 Broadcom announced its new Intensi-fi® XLR wireless LAN (WLAN) VoIP router SoC platform solutions with enhanced features that include 3G support, industry leading performance and best-in-class power consumption. System OEMs >more
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Freescale accelerates design innovation with 90 nanometer ColdFire+ mixed-signal microcontroller sol
Freescale Semiconductor is reinforcing its leadership in 32-bit microcontrollers (MCUs) with the announcement of 40 new ColdFire+ (plus) devices, taking its proven ColdFire portfolio to new heights. Built from 90 nanometer (nm) >more
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Linear Technology's 37V, 1.2A (Iout), 2.5MHz Step-Down DC/DC Converter
Linear Technology announces the H-Grade version of the LT3686. The LT3686H is a 1.2A, 37VIN step-down switching regulator. The LT3686H operates within a VIN range of 3.6V to 37V with overvoltage lockout, protecting the regulator >more
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Micrel Launches Industry's Triple Threat With Smallest Triple LDO Family
The MIC5387 extends Micrel's ever shrinking LDO regulator products by achieving an ultra small triple output LDO in a 1.6 x 1.6mm Thin MLF® package size which is a greater than 57 percent reduction when compared to the industry >more
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Molex VHDM® H-Series Backplane Connector System
Molex Incorporated has announced the release of the VHDM® H-Series (Very High Density Metric® H-Series) backplane connector system, which is designed for applications that require very high interconnect density and high-speed >more
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NS's FPD-Link III SerDes Provide Industry’s First Real-Time Bidirectional Control
NS unveiled its FPD-Link III family of automotive-grade serializer and deserializer (SerDes) chipsets featuring the industry’s first real-time, bidirectional control channel for driver-assist video cameras.
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OSRAM and Infineon Technologies introduce energy-efficient LED lamps to Sri Lanka
OSRAM Opto Semiconductors and Infineon Technologies both champion the cause of sustainable development and environmental protection. In collaboration with the OSRAM partner network LED Light for you, the German company Diana >more
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Semtech Enters Digital Power Market with 28V EcoSpeed™ I2C PWM Controller
Semtech announces the SC493, the company’s first digitally controlled DC-DC converter. The SC493 addresses today’s increasingly complex power management requirements by enabling users to digitally configure and interrogate >more
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STMicroelectronics' ULVF™ ultra-low VF power Schottky diodes - New heights of efficiency
With the increase of environmental awareness, efficiency is now one of the main selling points for power supply and computer manufacturers. Following this trend, ST is releasing a new family of high-performance power Schottky >more
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Vishay Releases New TFU Thick Film Flat Chip Fuses in Compact 0603 Chip Size
Vishay Intertechnology, Inc. (NYSE: VSH) today announced the release of new TFU 0603 thick film flat chip fuses that offer very quick-acting fuse characteristics in a smaller chip size. The devices feature rated current values up >more
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Worldwide Semiconductor Revenues Will Increase to $295 Billion in 2011 and
Surpass $340 Billion in 2014, According to IDC
International Data Corporation (IDC) expects global semiconductor revenue to reach $274 billion, $295 billion, and $344 billion in 2010, 2011, and 2014, respectively, with a compound annual growth rate (CAGR) of 8.8% over the >more
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Foxconn Group members investing in component players
Foxconn Electronics (Hon Hai Precision Industry) has recently announced plans to invest US$135 million to acquire several component and system makers in China, and has expanded its investment in two of its subsidiaries in China by >more
(Digitimes.com)
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STMicroelectronics Hosts Discussions on the Future of Automotive
Infotainment
STMicroelectronics (NYSE: STM), the world's largest supplier of components for digital radio receivers, will host this year's WorldDMB Car Manufacturers Workshop in Munich, Germany, on July 7, 2010. The international forum brings >more
(PR Business Wire)
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Industry Leaders Establish MIFARE4Mobile Industry Group
Seven leading players in the Near Field Communication (NFC) ecosystem, Ericsson, Gemalto, NXP, Oberthur Technologies, STMicroelectronics, Venyon, a company in the Giesecke&Devrient group, and ViVOtech, today joined forces to form >more
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Altera Presented with TechAmerica Foundation's American Technology Award
Altera Corporation announced its Stratix® IV GT FPGA received TechAmerica Foundation's American Technology Award in the electronic components category. TechAmerica recognized Altera for demonstrating excellence in technology with >more
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National Semiconductor Acquires GTronix; Adds to Analog Audio and Voice
Processing Capabilities for Wireless Handset Applications
National Semiconductor Corp. (NYSE:NSM) today announced it has acquired the technology of GTronix, a fabless semiconductor company specializing in programmable and adaptive analog sensory processing technology.
GTronix’s >more
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NXP's GreenChip TEA1733 product receives Green Power Award from China
electronic industry magazine - EEPW
NXP's GreenChip TEA1733 product receives Green Power Award from China electronic industry magazine - EEPW
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ANALOG DEVICES' DIGITAL VIBRATION SENSOR RECEIVES BEST OF SENSORS EXPO
AWARD FROM SENSORS MAGAZINE
Analog Devices, Inc. (ADI), a global leader in high-performance semiconductors for signal-processing applications, has received a Silver “Best of Sensors Expo” award for the ADIS16223 iSensor® digital tri-axial vibration >more
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